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Large temperature jumps in the structures of power semiconductor devices occurring when they are turned on and off significantly reduce the reliability of power circuits. Widely used electro-thermal modeling approaches for thermal circuits have a number of disadvantages: the use of interconnected Spice simulators and numerical 3D thermal field modeling tool requires a detailed description of 3D structures and a large computer time; the use of only Spice-like simulators of electrical circuits for mixed electro-thermal modeling require the creation of electro-thermal models of power components and significant CPU time costs due to the large difference in the time constants of the electrical and thermal parts. In this work, an improved scheme of multilevel automated electro-thermal modeling and simulation of power electronic components using Comsol software at the semiconductor device level, Spice simulation at the circuit level and Asonika-TM system at the printed circuit board (PCB) level is proposed and implemented. The developed additional software tools for the implementation of the proposed route are described, providing automation of power calculation processes in capacities of components of powerful circuits, components, of obtained values transferring to a thermal simulation tool and of forming electro-thermal models of circuit components. The correctness of the proposed modeling scheme was confirmed by the results of thermal-imaging analysis using an IR camera. The effectiveness of the proposed methodology was demonstrated through the example of a real PCB design with high-power MOSFETs for power stepper motor driving. In the analyzed circuit, a possible thermal failure of the output DMOSFETs due to their overheating was revealed. To improve conditions of their temperature value lowering it has been proposed to use larger electrode radiator with lesser thermal resistance.

Key words: high-power component, power circuit, MOSFET, PCB, Spice simulator, electro-thermal modeling, thermal sub-circuit, IR measurements
Published in: CIRCUIT ENGINEERING AND DESIGN
Bibliography link: Petrosyants K. O., Kharitonov I. A., Tegin M. S. Simulation of electrothermal transient responses in power PCB modules using Comsol, Spice, Asonika-ТМ. Proc. Univ. Electronics, 2024, vol. 29, no. 1, pp. 65–78. https://doi.org/10.24151/1561-5405-2024-29-1-65-78
Financial source: The work has been supported by the “Priority 2030” Program within the framework of the HSE strategic project “Digital Transformation: Technology, Effects, Efficiency” (project no. 23-22-00313).

Konstantin O. Petrosyants
National Research University Higher School of Economics (Russia, 123458, Moscow, Tallinnskaya st., 34); Institute of Design Problems of Microelectronics of Russian Academy of Sciences (Russia, 124365, Moscow, Zelenograd, Sovetskaya st., 3)

Igor A. Kharitonov
National Research University Higher School of Economics (Russia, 123458, Moscow, Tallinnskaya st., 34)

Mikhail S. Tegin
“Kompex-T” LLC (Russia, 117630, Moscow, Starokaluzhskoe ave., 62)

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Publication type: Scientific article
DOI: 10.24151/1561-5405-2024-29-1-65-78
RISC id: QXXHKC

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